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1 of 12 optimum technology matching? applied gaas hbt ingap hbt gaas mesfet sige bicmos si bicmos sige hbt gaas phemt si cmos si bjt gan hemt functional block diagram rf micro devices?, rfmd?, optimum technology matching?, enabling wireless connectivity?, powerstar?, polaris? total radio? and ultimateblue? are trademarks of rfmd, llc. bluetooth is a trade- mark owned by bluetooth sig, inc., u.s.a. and licensed for use by rfmd. all other trade names, trademarks and registered tradem arks are the property of their respective owners. ?2006, rf micro devices, inc. product description 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . ordering information bifet hbt ldmos 1 2 3 4 5 6 7 8 12 11 10 9 16 15 14 13 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 output input 10 input output rx filter rx filter lna vref lna vsel lna vcc v3s1 pavreg pabias pavcc v2s2 v1s2 ant v3s2 rx out/tx in v2s1 v1s1 pa in 1 pain2 pavcc rf6509 2.7v to 3.6v module for integration with 900mhz smart energy ami the rf6509 integrates a complete solution in a single front-end module (fem) for amr and smart grid solutions. the rf6509 integrates a 915mhz pa, some trans- mit (tx) filtering, input and output switch es, a tx or receive (rx) attenuation path, and an lna with bypass mode. the rf6509 has a single-ended input and output for optimized ease of use and implemen tation. the pin-out of the fem enables users to implement additional filtering exte rnal to the module, if needed. the device is provided in a lga, 32 pin, 8mm x 8mm x 1.2mm package. features ? tx output power: 29.5dbm ? tx gain: 31dbm ? rx gain: 18db ? rx noise figure: 2.5db ? integrated lna with bypass mode applications ? 868mhz/900mhz ism band application ? single chip rf front end module ? portable battery powered equipment ? wireless automatic metering applications rf6509 2.7v to 3.6v module for integration with 900mhz smart energy ami RF6509PCK-410 fully assembled evaluation board and 5 loose pieces. ds121128 ?? package style: lga, 32 pin, 8mm x 8mm x 1.2mm
2 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . absolute maximum ratings parameter rating unit overall dc supply voltage +5.0 v operating ambient temperature -40 to +85 c storage temperature -40 to +150 c low noise amplifier dc supply current 32 ma input rf power 5 dbm power amplifier dc supply current 1200 ma input rf power 10 dbm transmit/receive switch input rf power 33 dbm parameter specification unit condition min. typ. max. overall t = 25c, pav cc1 and pav cc1 = 3.2v, pa bias = 3.2v pav reg = 2.85v, unless otherwise noted usable frequency range 868 902 to 928 mhz input impedance 50 ? input vswr 2:1 output load vswr 6:1 pa section cw output power 29 29.5 dbm pa bias , p in = -3 < 0 < 3dbm small signal gain 29 31 db pa bias , p in = -20dbm second harmonic -42.5 dbc pa bias , p out = 29.5dbm at ant port third harmonic -72.5 dbc pa bias , p out = 29.5dbm at ant port fourth harmonic -42.5 dbc pa bias , p out = 29.5dbm at ant port input vswr 2:1 output vswr 6:1 oscillations <-60dbc power supply voltage 2.7 3.2 3.6 v power supply current 730 850 ma pa bias 70 100 ? av ccpa = 3.2v, pa bias = 3.2v, pav reg = 0v, power supply current for pa v bias 18.0 20.0 ma power supply current for pa v reg 70.0 100.0 ? a lna section high gain mode lnav cc = 3.0v, lnav ref = 3.0v, lnav sel = 0.0v, pa bias = 0.0v, pav reg = 0.0v gain 17.5 18 18.5 db 902mhz to 928mhz 15.5 16.5 17.5 db 868mhz noise figure 2.4 3.4 db input ip3 7.5 9.5 12 dbm output vswr 1.6:1 2:1 2.4:1 supply current 12 ma caution! esd sensitive device. exceeding any one or a combination of the absolute maximum rating conditions may cause permanent damage to the device. ex tended application of absolute maximum rating conditions to the device may reduce device reliability. specified typical perfor- mance or functional operation of the devi ce under absolute maximum rating condi- tions is not implied. the information in this publication is believed to be accurate and reliable. however, no responsibility is assumed by rf micro devices, inc. ("rfmd") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. no license is granted by implication or otherwise under any patent or patent rights of rfmd. rfmd reserves the right to change component circuitry, recommended appli- cation circuitry and specifications at any time without prior notice. rohs (restriction of hazardous subs tances): compliant per eu directive 2002/95/ec.
3 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . parameter specification unit condition min. typ. max. lna section (continued) low gain mode lnav cc = 3.0v, lnav ref = 3.0v, lnav sel = 0.0v, pa bias = 0.0v, pav reg = 0.0v gain -6 db noise figure 6 db supply current 3 ma lnav cc voltage 2.7 3.0 v lnav ref logic level high 2.7 3.0 v lnav ref logic level low 0.0 0.3 v lnav sel logic level high 1.8 3.0 v lnav sel logic level low 0.8 v power down current 10 ? a lna_en = low, lnav sel = low transceiver switch section insertion loss txin-pain 0.9 1 1.1 db v 1s1 = 3.0v, v 2s1 = 0.0v, v 3s1 = 0.0v isolation txin-pain 25 27 db v 1s1 = 0.0v, v 2s1 = 3.0v, v 3s1 = 0.0v or v 1s1 = 0.0v, v 2s1 = 0.0v, v 3s1 = 3.0v txin/rxout return loss (thru path) -15 -14 db v 1s1 = 0.0v, v 2s1 = 3.0v, v 3s1 = 0.0v and v 1s2 = 0.0v, v 2s2 = 3.0v, v 3s2 = 0.0v txin/rxout return loss (transmit path)? -9 db v 1s1 = 3.0v, v 2s1 = 0.0v, v 3s1 = 0.0v and v 1s2 = 0.0v, v 2s2 = 0.0v, v 3s2 = 3.0v txin/rxout return loss (receive path) -9 db v 1s1 = 0.0v, v 2s1 = 0.0v, v 3s1 = 3.0v and v 1s2 = 3.0v, v 2s2 = 0.0v, v 3s2 = 0.0v switch control logic high 2.7 3.0 v switch control logic low 0.0 0.4 v switch control current 13.0 15.0 ? a
4 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . parameter specification unit condition min. typ. max. antenna switch section insertion loss ant-lnain 0.9 1 1.1 db v 1s2 = 3.0v, v 2s2 = 0.0v, v 3s2 = 0.0v isolation ant-lnain 25 27 db v 1s2 = 0.0v, v 2s2 = 3.0v, v 3s2 = 0.0v or v 1s2 = 0.0v, v 2s2 = 3.0v, v 3s2 = 0.0v ant return loss (thru path) -15 -14 db v 1s1 = 0.0v, v 2s1 = 3.0v, v 3s1 = 0.0v or v 1s2 = 0.0v, v 2s2 = 3.0v, v 3s2 = 0.0v ant return loss (transmit path) -9 db v 1s1 = 3.0v, v 2s1 = 0.0v, v 3s1 = 0.0v or v 1s2 = 0.0v, v 2s2 = 0.0v, v 3s2 = 3.0v ant return loss (receive path) -9 db v 1s1 = 0.0v, v 2s1 = 0.0v, v 3s1 = 3.0v or v 1s2 = 3.0v, v 2s2 = 0.0v, v 3s2 = 0.0v switch control logic high 2.7 3.0 v switch control logic low 0.0 0.4 v switch control current 13.0 15.0 ? a
5 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . pin function description 1gnd ground. 2rx filter input rf output to enter the rx filter (if used), 50 ? nominal impedance. 3v2s2 logic input to the tx switch arm 2 , se lects/deselects thru path if logic high/low respectively, see truth table. 4v1s2 logic input to the tx switch arm 1, selects/deselects low noise amplifier if logic high/low respectively, see truth table. 5gnd ground. 6ant rf output to antenna for the tx/thru path and rf input from antenna for the rx/thru path, 50 ? nominal imped- ance. 7gnd ground. 8v3s2 logic input to the tx switch arm 3, selects/deselects pa if logic hi gh/low respectively, see truth table. 9nc not connected. 10 gnd ground. 11 pa vcc2 collector power supply for power amplifier. nominal 3.6v. 12 gnd ground. 13 nc not connected. 14 pa bias power supply for the pa bias network. nominal 3.6v. 15 gnd ground. 16 pa vreg voltage set to pa bias level. nomial 2.85v. 17 pa vcc1 collector power supply for pa driver stage. nominal 3.6v. 18 nc not connected. 19 nc not connected. 20 pa in rf input to the pa, 50 ? nominal impedance, needs to be connected externally to pa in to switch pin through as short as possible 50 ? transmission line. 21 pa in to switch pa input to be connected to the rx switch through this pin, 50 ? nominal impedance. 22 v2s1 logic input to the rx switch arm 2, se lects/deselects thru path if logic high/low respectively, see truth table. 23 v1s1 logic input to the rx switch arm 1, selects/deselects pa if logic hi gh/low respectively, see truth table. 24 gnd ground. 25 rx out/tx in transceiver in/out. 26 gnd ground. 27 v3s1 logic input to the rx switch arm 3, selects/deselects lna if logic high/low respectively, see truth table. 28 nc not connected. 29 lna vcc collector power cupply for lna. nominal 3.0v. 30 lna vsel a logic low selects the high gain mode of th e lna, logic high selects the low gain mode. 31 lna vref voltage to set the bias of the lna, nominal 3.0v, can be adjusted to shut the lna off or set the quiescent current of the lna to desired level. 32 lna in rf input to lna, nominal impedance 50 ? , the rx filter output should be connected to this pin, if rx filter is bypassed, pin 2 should be connected to this pin htough an external 50 ? transmission line as short as possible.
6 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . control logic table sw1 sw2 lna pa v1s1 v2s1 v3s1 v1s2 v2s2 v3s2 lna vsel lna vref lna vcc pa vcc1 and 2 pa bias pa vreg path high low low low low high high off off on on on tx path thru pa lowhighlow lowhighlowhighoff off x* off offtx/rx thru path with 10db attenu- ation low low high high low low low on on x* off off rx path thru lna (high gain mode) low low high high low low high on on x* off off rx path thru lna (low gain mode) high indicates logic high of >2.7v and low indicates lo gic low of <0.2v. *an x means that the state of the pin doesn?t matter. 10db lna pa rx out/tx in v3s1 v2s1 v1s1 1 2 3 v1s2 v2s2 v3s2 2 3 1 ant
7 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . pin out package drawing
8 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . evaluation board schematic note: 1. if extra isolation is needed between tx and rx path, the filter can be used otherwise for < 50db isolation, 50 ? micro- strip shoud be okay. 1 2 3 4 5 6 7 8 12 11 10 9 16 15 14 13 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 output input 10 input output n/c v2s2 v1s2 50 ? ? strip j1 ant v3s2 c1 10 uf c2 68 pf pavcc2 c3 0.1 uf pabias lnavref lnavsel lnavcc v3s1 50 ? ? strip j2 rx out/tx in v1s1 v2s1 50 ? ? strip c4 0.1 uf c6 10 uf pavcc1 c5 0.1 uf pavreg rx filter rx filter n/c n/c n/c n/c
9 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . pcb design requirements pcb surface finish the pcb surface finish used for rfmd's qualification process is electroless nickel, immersion gold. typical thickness is 3 ? inch to 8 ? inch gold over 180 ? inch nickel. pcb land pattern recommendation pcb land patterns are based on ipc-sm-782 standards when po ssible. the pad pattern shown has been developed and tested for optimized assembly at rfmd; however, it may require so me modifications to address co mpany specific assembly pro- cesses. the pcb land pattern has been develope d to accommodate lead and package tolerances. pcb solder mask pattern liquid photo-imageable (lpi) so lder mask is recommended. the solder mask fo otprint will match what is shown for the pcb metal land pattern with a 2mil to 3mil expansion to accommoda te solder mask registration clearance around all pads. the center-grounding pad shall also have a solder mask clearance. expansion of the pads to create solder mask clearance can be provided in the master data or reques ted from the pcb fabrication supplier. thermal pad and via design the pcb metal land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. thermal vias are required in the pcb layout to effectively conduct heat away from the package. the via pattern has been designed to address thermal, power dissipa tion and electrical requirements of the device as well as accommodating routing strategies. the via pattern used for the rfmd qualification is based on thru -hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. if micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
10 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . typical performance
11 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . typical performance
12 of 12 rf6509 ds121128 7628 thorndike road, greensboro, nc 27409-9421 for sales or technical support, contact rfmd at (+1) 336-678-5570 or customerservice@rfmd.com . rohs compliant: yes package total weight in grams (g): 0.038 compliance date code: 0547 bill of materials revision: a pb free category: e3 pb cd hg cr vi pbb pbde die 000000 molding compound 000000 lead frame 000000 die attach epoxy 000000 wire 000000 solder plating 000000 * directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment rohs* banned material content bill of materials parts per million (ppm) this rohs banned material content declaration was prepared solely on information, including analytical data, provided to rfmd b y its suppliers, and applies to the bill of materials (bom) revision noted above.

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